Rogers PCB/Rogers TMM4 Microwave Printed Circuit Board 15mil 20mil 25mil 30mil 50mil 60mil With Immersion Gold
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    Rogers TMM4 Microwave Printed Circuit Board 15mil 20mil 25mil 30mil 50mil 60mil With Immersion Gold

    (Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)


    Rogers TMM4 Microwave Material Overview

    Rogers TMM4 is a thermoset microwave material that combines ceramic, hydrocarbon, and thermoset polymer composites, specifically designed for high reliability in plated-through-hole applications, including stripline and microstrip configurations. It features a dielectric constant of 4.70, offering a blend of electrical and mechanical properties that harness the advantages of both ceramic and traditional PTFE microwave materials, while eliminating the need for specialized production techniques. Notably, TMM4 does not require sodium naphthanate treatment prior to electroless plating.


    Key Properties

    Thermal Coefficient of Dielectric Constant: Exceptionally low, typically less than 30 PPM/°C.
    Coefficient of Thermal Expansion: Isotropic and closely matched to copper, ensuring reliable plated-through holes and minimal etch shrinkage values.
    Thermal Conductivity: Approximately twice that of conventional PTFE/ceramic materials, which aids in heat removal.
    Thermoset Resins: TMM4 does not soften when heated, allowing for safe wire bonding of component leads to circuit traces without the risk of pad lifting or substrate deformation.


    PCB Capability (TMM4)

    PCB Material:

    Composite of Ceramic, hydrocarbon and thermoset polymer

    Designator:

    TMM4

    Dielectric constant:

    4.5  ±0.045 (process);                                                               4.7 (design)

    Layer count:

    Single Sided, Double Sided, Multi-layer, Hybrid designs

    Copper weight:

    1oz (35µm), 2oz (70µm)

    Laminate thickness:

    15mil (0.381mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm), 150mil (3.810mm), 200mil (5.08mm), 250mil (6.35mm), 500mil (12.7mm)



    Typical Applications

    Chip testers
    Dielectric polarizers and lenses
    Filters and couplers
    Global Positioning System (GPS) antennas
    Patch antennas
    Power amplifiers and combiners
    RF and microwave circuitry
    Satellite communication systems



    Data Sheet of TMM4

    Click to expand/collapse the table

    TMM4 Typical Value

    Property

    TMM4

    Direction

    Units

    Condition

    Test Method

    Dielectric Constant,εProcess

    4.5±0.045

    Z

     

    10 GHz

    IPC-TM-650 2.5.5.5

    Dielectric Constant,εDesign

    4.7

    -

    -

    8GHz to 40 GHz

    Differential Phase Length Method

    Dissipation Factor (process)

    0.002

    Z

    -

    10 GHz

    IPC-TM-650 2.5.5.5

    Thermal Coefficient of dielectric constant

    +15

    -

    ppm/°K

    -55℃-125℃

    IPC-TM-650 2.5.5.5

    Insulation Resistance

    >2000

    -

    Gohm

    C/96/60/95

    ASTM D257

    Volume Resistivity

    6 x 108

    -

    Mohm.cm

    -

    ASTM D257

    Surface Resistivity

    1 x 109

    -

    Mohm

    -

    ASTM D257

    Electrical Strength(dielectric strength)

    371

    Z

    V/mil

    -

    IPC-TM-650 method 2.5.6.2

    Thermal Properties

    Decompositioin Temperature(Td)

    425

    425

    ℃TGA

    -

    ASTM D3850

    Coefficient of Thermal Expansion - X

    16

    X

    ppm/K

    0 to 140 ℃

    ASTM E 831 IPC-TM-650, 2.4.41

    Coefficient of Thermal Expansion - Y

    16

    Y

    ppm/K

    0 to 140 ℃

    ASTM E 831 IPC-TM-650, 2.4.41

    Coefficient of Thermal Expansion - Z

    21

    Z

    ppm/K

    0 to 140 ℃

    ASTM E 831 IPC-TM-650, 2.4.41

    Thermal Conductivity

    0.7

    Z

    W/m/K

    80 ℃

    ASTM C518

    Mechanical Properties

    Copper Peel Strength after Thermal Stress

    5.7 (1.0)

    X,Y

    lb/inch (N/mm)

    after solder float 1 oz. EDC

    IPC-TM-650 Method 2.4.8

    Flexural Strength (MD/CMD)

    15.91

    X,Y

    kpsi

    A

    ASTM D790

    Flexural Modulus (MD/CMD)

    1.76

    X,Y

    Mpsi

    A

    ASTM D790

    Physical Properties

    Moisture Absorption (2X2)

    1.27mm (0.050")

    0.07

    -

    %

    D/24/23

    ASTM D570

    3.18mm (0.125")

    0.18

    Specific Gravity

    2.07

    -

    -

    A

    ASTM D792

    Specific Heat Capacity

    0.83

    -

    J/g/K

    A

    Calculated

    Lead-Free Process Compatible

    YES

    -

    -

    -

    -



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